- Simple design to perfectly protect the cooling module
- High thermal conductive adhesive
- Supports Intel & AMD motherboards
- Selected high-quality IC
- Supports XMP2.0
- Energy saving with ultra-low working voltage
Reinforced structure and enhanced heat dissipation
T-FORCE VULCAN Z’s all new cooling module is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, with superconductivity – thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the gaming memory can be maintained within operating temperature, and offering the finest and smoothest gaming experience and an extreme performance without any lag.
Selected IC chips. Stable and durable
Every IC chip made for TEAMGROUP's T-FORCE VULCAN Z DDR4 gaming memory is selected through a rigorous testing process. Every overclocking memory is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.
High performance, low power consumption and upgrade easily
In addition to the increase in data transfer rate, the basic working voltage of the new generation of DDR4 memory is also decreased to 1.2V. This desktop memory is energy saving, high performance and low power consumption.
Supports Intel XMP and auto overclocking
T-FORCE VULCAN Z DDR4 gaming memory is plug and play ready. Overclocking can be super easy without the hassle of manually adjusting the BIOS. It is compatible to both Intel & AMD platform, therefore gamers can build their system without worries.